NEW ! High Performance ACF Materials at Lower Cost !

We have the most Cost effective ACF materials solutions in the market, give your company an advantage by switching to our new Product ! Yes, it has been qualified and used by major MNC customers for productions.

So, Up your Quality , Lower your Cost !

Contact us now for a discussion .

PCBA / SMT AOI Inspection Machine (Model MT-0808)

This AOI Inspection machine has combined the best & most advanced algorithms in vision inspection technologies and widely regarded as one of the best equipment available today. High capability at affordable price, this is one equipment that will drive up the output and quality of any electronics assembly factories.

Basic Specifications :
- Process : Post reflow inspection
- Inspection : Migration, Tombstone, Wrong part, Missing part, Overturned part, Damaged part, Cold joint, Insufficient/ excess solder
- Camera : CCD Camera , FOV : 20x20mm
- Camera speed : 25ms/FOV

Switching Power Supplies

Our CE Safety Approval series Switching Power Supplies give you the safety and reliability most critical to your equipment. All our power supplies products come with 2 year warranty.

Basic Specifications
- Power : 20W ~ 500W
- Power input : Universal 86~264VAC
- Power output : 5, 12, 15, 24, 48V etc...
- With metal casings or open frame

Ultrasonic Bonding Machine for FOB
(Ultrasonic/ Constant heat/ Pulse heat)

Basic Specifications

- Substrate Size: Max 75x75mm
- FPC Size : Max 75x75mm
- Alignment Accuracy : +/-20um
- Pressure : Max 800N
- Head Temperature : Max 200°C/ Max 350°C/ Max 450°C
- Stage Temperature : Max 100degC

*We can also sell Ultrasonic Head Only !

Ultrasonic Flip Chip Bonder for FOB (Film on Board)

Basic Specifications

- Substrate Size : Max 75x75mm
- Chip Size : □1mm ~ □25mm
- Alignment Accuracy : ±5um (Auto-alignment)
- Chip Supply : Auto flip chip function
- Pressure : Max 400N
- Head Temperature : Max 200°C/ Max 350°C/ Max 450°C
- Stage Temperature : Max 100°C
- Heating Method : Cartridge heater / Pulse Heat Control

TFT/LCD Module Assembly Equipment Supply

You will find here the latest TFT/LCD module assembly equipment to meet your product quality at your budget.

Our equipment is designed in Japan and used by many major Japanese MNCs.

1. ACF Tape Attached System
2. IC Alignment System
3. FPC/TCP Alignment System
4. IC/TAB/TCP Chip Bonding System
5. LCD Panel Inspection System

To meet your budget, we offer both the Manual and Semiautomatic Systems. Please enquire for more details.

TFT/LCD Module Related component Supply

Need components for your repair or manuacturing, contact us and let us help make your job easier.

TFT/LCD Repair Services

We provide you our latest TFT/LCD module components to meet your product quality.

-- COF Module (IC + FPC)

-- CCFL

-- others...

TFT/LCD Panel Contract Manufacturing Services

If you require TFT/LCD Module assembly services, we will gladly provide our assembly services to you at very affordable cost.

This service is specially catered for design house to meet their R&D prototyping, and for small scale production. We can discuss any customized solutions for large volume production requirement.

These are the 3 basic ways of assembly:

1. COG (Chip on Glass)
2. COF (Chip on Film)
3. FOG (Film on Glass)