NEW ! High Performance ACF Materials at Lower Cost !

We have the most Cost effective ACF materials solutions in the market, give your company an advantage by switching to our new Product ! Yes, it has been qualified and used by major MNC customers for productions.

So, Up your Quality , Lower your Cost !

Contact us now for a discussion .

Ultrasonic Bonding Machine for FOB
(Ultrasonic/ Constant heat/ Pulse heat)

Basic Specifications

- Substrate Size: Max 75x75mm
- FPC Size : Max 75x75mm
- Alignment Accuracy : +/-20um
- Pressure : Max 800N
- Head Temperature : Max 200°C/ Max 350°C/ Max 450°C
- Stage Temperature : Max 100degC

*We can also sell Ultrasonic Head Only !

Ultrasonic Flip Chip Bonder for FOB (Film on Board)

Basic Specifications

- Substrate Size : Max 75x75mm
- Chip Size : □1mm ~ □25mm
- Alignment Accuracy : ±5um (Auto-alignment)
- Chip Supply : Auto flip chip function
- Pressure : Max 400N
- Head Temperature : Max 200°C/ Max 350°C/ Max 450°C
- Stage Temperature : Max 100°C
- Heating Method : Cartridge heater / Pulse Heat Control

TFT/LCD Module Assembly Equipment Supply

You will find here the latest TFT/LCD module assembly equipment to meet your product quality at your budget.

Our equipment is designed in Japan and used by many major Japanese MNCs.

1. ACF Tape Attached System
2. IC Alignment System
3. FPC/TCP Alignment System
4. IC/TAB/TCP Chip Bonding System
5. LCD Panel Inspection System

To meet your budget, we offer both the Manual and Semiautomatic Systems. Please enquire for more details.

TFT/LCD Module Related component Supply

Need components for your repair or manuacturing, contact us and let us help make your job easier.

TFT/LCD Repair Services

We provide you our latest TFT/LCD module components to meet your product quality.

-- COF Module (IC + FPC)

-- CCFL

-- others...

TFT/LCD Panel Contract Manufacturing Services

If you require TFT/LCD Module assembly services, we will gladly provide our assembly services to you at very affordable cost.

This service is specially catered for design house to meet their R&D prototyping, and for small scale production. We can discuss any customized solutions for large volume production requirement.

These are the 3 basic ways of assembly:

1. COG (Chip on Glass)
2. COF (Chip on Film)
3. FOG (Film on Glass)

True 3D Viewing Systems

3D Viewing

Want to experience True 3D Viewing ? We have the most exciting stereoscopic visualization solutions for applications in Science, industry, and Entertainment. Check out our latest stereoscopic monitors, stereo upgrade kits and stereoscopic eyewear for uses in CAD/CAM, Molecular Modelling, Geographical Information Systems (GIS), Simulation, Training, and Virtual Reality.

NuVision 21MX-SL

NuVision 17SX/ 21SX

NuVision 60GX